Thermal Gap Filler Pads
Super cost-effective thermal gap filler pad
ES900 Thermal Gap Filler Pads provide effective thermal interfaces between heat sinks and electronic devices, accommodating for uneven surfaces, air gaps and rough surface textures. The thermally conductive pad’s soft construction offers high conformability to reduce interface resistance. In addition to effective heat dissipation, thermal Gap Pads also help reduce vibration stress for shock dampening.
Exceptionally simple to use, ES900 materials are manufactured to size and facilitate easy application: operators simply peel the protective film and place the thermal management pad on the desired component.
ES900 are produced in a variety of standard dimensions and thicknesses, but can also be customized for specific application requirements. Available as custom die cut parts with the ability to individualize thickness and constructions, thermal Gap Pad materials are always fit for purpose to ensure optimized thermal control no matter what the application.
· Soft, Excellent Compression Rate
· Low Thermal Impedance
· UL94 V-0 Flammability Rated
· RoHS & HALOGEN Compliant
· Surface with viscous
· Material Specific Thermal Conductivity
· Excellent electrical insulation performance and heat resistance
· Lower cost, super cost-effective
· Between chip and heat-dissipation modules
· Optoelectronic Industry
· Netcom products
· New energy Battery and Vehicles Industry
· Household appliances
· Wearable equipment
· Memory modules
· Heat pipe assemblies